pk662 (v1.0) a ug 22 , 2014 www.xilinx.com 1 pk 662 ( v1.0 ) a ug 22 , 201 4 100% material declaration data sheet for spartan - 3an tq g 144 cu wire package average weight: 1.294 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 1 0.003870 0.299% silicon 7440-21 -3 100.00 0.003870 silicon die 2 0.001158 0.090% silicon 7440-21 -3 100.00 0.001158 die attach 0.000960 0.074% solid epoxy resin na 12.50 0.000120 phenol resin na 12.50 0.000120 amorphous silica 7631-86 -9 35.00 0.000336 synthetic rubber na 40.00 0.000384 mold compound 1.114842 86.155% epoxy resin trade secret 10.00 0.111484 phenol resin trade secret 5.00 0.055742 silica(amorphou s) a 60676- 86-0 74.00 0.824983 silica(amorphou s) b 7631-86 -9 10.00 0.111484 carbon black 1333-86 -4 1.00 0.011148 copper wire 0.001247 0.096% copper 7440-50 -8 98.25 0.001225 palladium 7440-05 -3 1.75 0.000022 gold wire 0.000135 0.01 0 % gold 7440-57 -5 99.05 0.000134 palladium 7440 - 05 - 3 0.95 0.000001 calcium 7440 - 70 - 2 0.00 0.000000 lead f rame tape 0.006000 0.46 4 % polyimide trade secret 43.00 0.002580 poly - ethlene - terephthalate 25038- 59-9 38.00 0.002280 nbr 9003 - 18 - 3 7.00 0.000420 bismaleimide 79922 - 55 - 7 6.00 0.000360 phenol resin 28453 - 20 - 5 6.00 0.000360 ? copyright 2014 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet for 7 series csg325 package pk662 (v1.0) a ug 22 , 2014 www.xilinx.com 2 co mponent substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total lead f rame 0.152383 11.776 % copper 7440 - 50 - 8 94.40 0.143850 silver 7440 - 22 - 4 1.50 0.002286 magnesium 7439-95 -4 0.18 0.000267 silicon 7440-21 -3 0.73 0.001105 nickel 7440-02 -0 3.20 0.004876 film 0.00000 6 0.0 0 0% solid epoxy resin na 12.50 0.000001 phenol resin na 12.50 0.000001 amorphous silica 7631-86 -9 35.00 0.000002 synthetic rubber na 40.00 0.000002 solder plating 0.013400 1.036 % tin 7440-31 -5 100 .00 0.01 3400
100% material declaration data sheet for 7 series csg325 package pk662 (v1.0) a ug 22 , 2014 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (?contractors?). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 0 8 /2 2 /201 4 1.0 xilinx initial release
|
